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SMD REWORK: - Micro Assembly - FINEPLACER® pico ma |
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Micro Assembly: - |
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FINEPLACER® pico ma
Multi-purpose Die Bonder
The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.
This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding.
Designed for prototyping or low-volume production, R&D and universities.
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Highlights: - |
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- Placement accuracy 5 µm*
- Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm*
- Working area up to 450 mm x 234 mm*
- Supports wafer/substrate sizes* up to 8" *
- Supports bonding forces up to 400 N*
- Can be configured as a hot air rework system
- Manual and semi-automatic configurations
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| Features |
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Benefits |
- Automated processes
- Overlay vision alignment system (VAS) with fixed beam splitter
- Integrated Process Management (IPM)
- Real time process observation camera
- Advanced system software with adaptive process library
- Process transfer from system to system
- Process flexibility due to modular concept
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- Hands-off die placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
- Immediate visual feedback reduces process development time
- Fast and easy process development, process recording and reporting, photo capture
- Process transfer from R&D to production saves time, guarantees reliable results
- One system handles a wide variety of applications
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| Technologies |
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Applications |
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| Technical Specifications |
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| Placement accuracy*: |
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5 µm |
| Field of view (min)1: |
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1.6 mm x 1.2 mm |
| Field of view (max)1: |
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20 mm x 15 mm |
| Component size (min)1: |
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0.125 mm x 0.125 mm |
| Component size (max)1: |
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40 mm x 40 mm |
| Theta fine travel: |
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± 6° |
| Z-travel |
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10 mm |
| Working area1: |
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280 mm x 117 mm |
| Bonding force (max)1,2*: |
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400 N |
| Heating temperature (max)1,2*: |
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400 °C |
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| Modules & Options |
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