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SMD REWORK: - Micro Assembly - FINEPLACER® lambda |
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Micro Assembly: - |
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FINEPLACER® lambda
Flexible Sub-micron Die Bonder
The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications.
It is the ideal choice for low volume production, prototyping, education and R&D where process flexibility is the key.
This cost- effective die bonder handles a wide range of sophisticated processes, including Indium bonding as well as extremely sensitive materials such as GaAs or GaP.
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Highlights: - |
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- Sub-micron placement accuracy
- Unique optical resolution
- Handles ultra small components
- Special tools allow object sizes down to 5 µm*
- Supported substrate size up to 6" *
- Closed loop force control*
- Small footprint and compact design
- Optics movement with programmable positions
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| Features |
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Benefits |
- Automated processes
- Overlay vision alignment system (VAS) with fixed beam splitter
- Robust construction and modular design
- Integrated Process Management (IPM)
- Real time process observation camera
- Adaptive process library
- Process transfer from system to system
- Virtually unlimited range of advanced bonding technologies
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- Hands-off die placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Provides high level of reproducibility and application flexibility
- Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
- Immediate visual feedback reduces process development time
- Fast and easy process development
- Process transfer from R&D to production saves time, guarantees reliable results
- ROI savings - one machine for all applications
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| Technologies |
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Applications |
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| Technical Specifications |
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| Placement accuracy*: |
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± 0.5 µm |
| Field of view (min)1: |
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0.4 mm x 0.3 mm |
| Field of view (max)1: |
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6 mm x 4.5 mm |
| Component size (min)1: |
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0.1 mm x 0.1 mm |
| Component size (max)1: |
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15 mm x 15 mm |
| Theta fine travel: |
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± 5° |
| Z-travel |
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10 mm |
| Working area1: |
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190 mm x 52 mm |
| Bonding force (max)2*: |
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0.1 N - 400 N |
| Heating temperature (max)1,2*: |
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400 °C |
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| Modules & Options |
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