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SMD REWORK: - Micro Assembly - FINEPLACER® pico ama |
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Micro Assembly: - |
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FINEPLACER® pico ama
Automated Flip Chip Bonder
The FINEPLACER® pico ama is a cost effective, fully-automated bonder, offering a high level of application flexibility.
This award winning system is targeted for low volume production environments, as well as product and process development where flexibility is crucial.
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Highlights: - |
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- Placement accuracy 5 µm @ 3 sigma*
- Components from 0.125 mm x 0.125 mm to 40 mm x 50 mm*
- Working area up to 450 mm x 117 mm*
- Supports wafer/substrate sizes up to 8" *
- Supports bonding forces up to 50 N*
- Closed loop force control
- Fully automatic operation and assembly process
- Precise non-wearing xy planar table
- Traceability support with open data interface structure
- Flexible, cost effective performance
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| Features |
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Benefits |
- Automated pattern recognition, alignment and bonding
- Overlay vision alignment system with fixed beam splitter
- Integrated Process Management (IPM)
- Adaptive process library
- Live process observation camera
- Virtually unlimited range of advanced bonding technologies
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- Full automatic, user independent process
- Outstanding placement accuracy and instant operation without adjustments
- Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
- Fast and easy process development
- Immediate visual feedback reduces process development time
- ROI savings - one machine for all applications
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| Technologies |
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Applications |
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| Technical Specifications |
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| Placement accuracy*: |
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5 µm @ 3 sigma |
| Field of view (min)1: |
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2 mm x 1.5 mm |
| Field of view (max)1: |
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14 mm x 10.5 mm |
| Component size (min)1: |
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0.125 mm x 0.125 mm |
| Component size (max)1: |
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40 mm x 25 mm |
| Theta fine travel: |
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± 6° / 1 m° |
| Z-travel / resolution: |
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10 mm / 0.8 µm |
| Y-travel / resolution: |
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155 mm / 0.64 µm |
| X-travel / resolution: |
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380 mm / 0.64 µm |
| Working area1: |
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380 mm x 117 mm |
| Bonding force (max)1,2*: |
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0.1 N - 50 N |
| Heating temperature (max)1,2*: |
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400 °C |
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| Modules & Options |
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