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SMD REWORK: - Micro Assembly - FINEPLACER® matrix ma |
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Micro Assembly: - |
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FINEPLACER® matrix ma
Semi-automatic Die Bonder
The FINEPLACER® matrix ma is a semi-automatic bonder representing the latest development from Finetech. Encompassing the “Built to be Best” philosophy, this system points the way forward for the Finetech product family.
Incorporating a new ergonomic approach to bonder design, this state-of-the-art platform, with large working area and high placement accuracy, combines application modularity within an open hardware and software environment.
Supporting a virtually unlimited field of applications and numerous bonding technologies, the system ensures compatibility with future technologies as users transition from R&D into production.
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Highlights: - |
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- Placement accuracy 3 µm*
- Components from 0.1 mm x 0.1 mm to 150 mm x 150 mm*
- Substrate sizes up to 350 mm x 350 mm*
- Supports wafer sizes up to 12" *
- Closed loop force control
- Real time contrast optimization with LED lighting
- Low maintenance, easy service access as a design priority
- Fast conversion from die bonder to rework station*
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| Features |
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Benefits |
- Automated processes
- Overlay vision alignment system (VAS) with fixed beam splitter
- Integrated Process Management (IPM)
- Real time process observation camera
- Process transfer from system to system
- Virtually unlimited range of advanced bonding technologies
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- Hands-off die placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
- Immediate visual feedback reduces process development time
- Process transfer from R&D to production saves time, guarantees reliable results
- ROI savings - one machine for all applications
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| Technologies |
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Applications |
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| Technical Specifications |
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| Placement accuracy*: |
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3 µm |
| Field of view (min)1: |
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1.2 mm x 0.9 mm |
| Field of view (max)1: |
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15.7 mm x 11.9 mm |
| Component size (min)1: |
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0.1 mm x 0.1 mm |
| Component size (max)1: |
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100 mm x 100 mm |
| Theta fine travel: |
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± 2° |
| Z-travel |
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10 mm |
| Working area1: |
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310 mm x 197 mm |
| Bonding force (max)2*: |
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500 N |
| Heating temperature (max)1,2*: |
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400 °C |
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| Modules & Options |
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