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SMD REWORK: - Advanced Rework - FINEPLACER® micro rs |
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Advanced Rework: - |
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FINEPLACER® micro rs
Hot Air SMD Rework Station
The FINEPLACER® micro rs is an enhanced hot air rework station for assembly and rework of all standard types of SMD components.
A high level of process modularity allows all rework process steps within one system. The system is at home in production environments, R&D, process development and prototyping.
The FINEPLACER® micro rs covers ultra small to large SMD components on small to large sized PCBs, with the goal to have highly reproducible soldering results.
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Highlights: - |
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- Industry-leading thermal management
- Components from 0.125 mm x 0.125 mm to 90 mm x 90 mm*
- Board sizes up to 460 mm x 310 mm*
- High efficiency board heater
- Closed loop force control*
- Automated top heater calibration
- Placement accuracy better than 10 µm
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| Features |
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Benefits |
- Automated soldering processes
- Overlay vision alignment system (VAS) with fixed beam splitter
- Modular design
- Integrated Process Management (IPM)
- Real time process observation camera
- Adaptive process library
- Process transfer from system to system
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- Hands-off component placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Provides high level of application flexibility
- Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision
- Immediate visual feedback reduces process development time
- Fast and easy process development
- Identical results on different machines allow central profile development,administration and distribution
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| Technologies |
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Applications |
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- Soldering of:
- BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
- Small passives down to 0201
- RF shields, RF frames
- Connectors, sockets
- Sub assemblies, daughter boards
- Flipchip (C4)
- Pin in Paste (PiP)
- Trough Hole Reflow (THR)
- Reworkable underfill, conformal coating
- Single ball rework
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| Technical Specifications |
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| Placement accuracy*: |
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10 µm |
| Field of view (min)1: |
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13.8 mm x 11.6 mm |
| Field of view (max)1: |
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71 mm x 58 mm |
| Component size (min)1: |
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0.125 mm x 0.125 mm |
| Component size (max)1: |
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60 mm x 60 mm |
| Thermocouples 2*: |
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2-8 |
| Top Heating: |
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| Power: |
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900 W |
| Temperature ramp rate: |
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1 K/s - 50 K/s |
| Flow range: |
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10 Nl/min - 70 Nl/min |
| Board Heating: |
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| Power: |
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2100 W |
| Heated area (max): |
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380 mm x 285 mm |
| Flow range: |
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96 Nl/min |
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| Modules & Options |
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* depending on configuration/application
1 standard value, other values on request
2 optional module
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