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SMD REWORK: - Advanced Rework - FINEPLACER® matrix rs |
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Advanced Rework: - |
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FINEPLACER® matrix rs
High Volume Rework Station
The FINEPLACER® matrix rs is a semi-automatic rework station representing the latest development from Finetech, encompassing the "Built to be Best" philosophy.
With a high level of process modularity, the system supports the complete rework cycle in a platform ergonomically designed to provide a state-of-the-art technical solution, low maintenance and easy service access.
Open application architecture ensures compatibility with future technologies as users transition from R&D into OEM production.
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Highlights: - |
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- Industry-leading thermal management
- Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm*
- Board sizes up to 460 mm x 390 mm*
- Automated top heater calibration
- Closed loop force control
- Real time contrast optimization with LED lighting
- Fast conversion from rework station to die bonder
- Ergonomic and intuitive design reduces user fatigue
- Placement accuracy better than 10 µm
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| Features |
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Benefits |
- Automated processes
- Vision alignment system with fixed beam splitter
- Integrated Process Management (IPM)
- Real time process observation camera
- Adaptive process library
- Process transfer from system to system
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- Hands-off component placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment and illumination
- Immediate visual feedback reduces process development time
- Fast and easy process development
- Identical results on different machines allow central profile development, administration and distribution
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| Technologies |
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Applications |
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- Soldering of:
- BGA, µBGA/CSP, QFN, DFN, PoP, QFP, PGA, SON
- Small passives down to 01005
- RF shields, RF frames
- Connectors, sockets
- Sub assemblies, daughter boards
- Flipchip (C4)
- Pin in Paste (PiP)
- Through Hole Reflow (THR)
- Reworkable underfill, conformal coating
- Single ball rework
- Micro assembly applications
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| Technical Specifications |
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| Placement accuracy*: |
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10 µm |
| Field of view (min)1: |
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3.5 mm x 2.6 mm |
| Field of view (max)1: |
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43 mm x 32 mm |
| Component size (min)1: |
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0.125 mm x 0.125 mm |
| Component size (max)1: |
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100 mm x 100 mm |
| Theta fine travel : |
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± 2° |
| Thermocouples*: |
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8 |
| Top Heating: |
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| Power: |
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900 W |
| Temperature ramp rate: |
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1 K/s - 50 K/s |
| Flow range: |
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10 Nl/min - 70 Nl/min |
| Board Heating: |
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| Power: |
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4200 W (12 zones) |
| Heated area (max): |
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450 mm x 300 mm |
| Flow range: |
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192 Nl/min |
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| Modules & Options |
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* depending on configuration/application
1 standard value, other values on request
2 optional module
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