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 PCI Limited Products > PCB Assembly & Testing Division > SMD Rework > Advanced Rework :-
 
   
 
SMD REWORK: - Advanced Rework - Related Equipment
 
 
 
 
  Advanced Rework: -
 

 
 

Related Equipment
Useful Enhancements for FINEPLACER® Systems

Finetech offers various stand-alone solutions to flexibly enhance a FINEPLACER® workplace. Outsourcing specific process steps make for an optimized workflow as well as significantly increased through-put.

 
  Description: -
The MINIOVEN 04 is a compact and flexible IR reballing solution suitable for a wide range of SMD components. It provides smart functions such as integrated air circulation, nitrogen support and the easy-to-use interface. The optimized heat distribution allows even heating of the whole component. Combined with nitrogen unwanted oxidation process will be significantly reduced. The benefits are obvious: excellent wetting behavior of lead-free solders, increased surface tension and drastically improved long-time stability.

The MINIOVEN 04 integrates the entire temperature cycle for a defined reflow of grid arrays (e.g. BGA/CSP) and QFN/MLF components. Thanks to the intuitive, display supported user interface it is a breeze to work with and edit the up to 99 different soldering profiles. The integrated profile library makes finding the process parameters for newly added component classes more comfortable than ever. Variable soaking time and target temperature as well as adjustable offset and damping add to the process stability.

The MINIOVEN 04 is the ideal supplement for all FINEPLACER® rework stations. The compact tabletop device provides a stand-alone solution for component preparation which makes it an alternative to the BGA Reballing Module.

     
      Highlights: -
Fineplacer micro rs  
  • Compact tabletop device
  • Integrated nitrogen support
  • Cost-efficient solution for BGA reballing and QFN printing
  • Optimized heat distribution
  • Intuitive operation
  • Integrated profile library
  • Wide selection of accessories
     
 Technical Specifications    
 Component size (min)1:   15 mm x 15 mm
 Component size (max)1:   60 mm x 60 mm
 Heated area   130 mm x 105 mm
 Power (max.)   500 W
 Temperature ramp rate   Limited to 3.5 K/s
 Heating temperature (max.)   280°C
 Process gas supply   yes
 Internal temperature sensor   K-type sensor
 Number of programs (max.)   99
 Dimension outside   140 mm x 290 mm x 83 mm
 Dimension inside   80 mm x 80 mm x 20 mm
     

HOTBEAM 04 - IR Pre-heating Solution

  Description: -
The compact and flexible IR underheater HOTBEAM 04 is the ideal supplement to a FINEPLACER® rework station. With modest space requirements and an overall height of only 40 mm, the IR underheater can be accommodated on every working table while providing very ergonomic operation. In engineering and research labs it is the premium choice for pre-heating and manual rework of small boards, e.g. of mobile devices. The HOTBEAM 04 allows storage of up to 99 different temperature profiles.

      Highlights: -
Fineplacer micro rs  
  • Compact tabletop device
  • Cost-efficient pre-heating solution
  • Ergonomic design
  • Even heat distribution
  • Intuitive operation
     
     
 Technical Specifications    
 Heating area   130 mm x 105 mm
 Power   50 W - 500 W
 Heated area   130 mm x 105 mm
 Temperature ramp rate   Limited to 3,5 K/s
 Heating temperature (min.)   50°C
 Heating temperature (max.)   260°C
 Number of programs (max.)   99
     

 

 
*Technical data are standard values (other values on request). Specifications given are subject to change without notice and may not be used as a basis for a binding offer or quotation.