|
|
|
|
|
|
|
|
|
SMD REWORK: - Micro Assembly - FINEPLACER® pico ma |
|
|
|
|
|
Micro Assembly: - |
|
|
|
|
|
FINEPLACER® pico ma
Multi-purpose Die Bonder
The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.
This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding.
Designed for prototyping or low-volume production, R&D and universities.
|
|
|
|
|
Highlights: - |
|
|
- Placement accuracy 5 µm*
- Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm*
- Working area up to 450 mm x 234 mm*
- Supports wafer/substrate sizes* up to 8" *
- Supports bonding forces up to 400 N*
- Can be configured as a hot air rework system
- Manual and semi-automatic configurations
|
|
|
|
Features |
|
Benefits |
- Automated processes
- Overlay vision alignment system (VAS) with fixed beam splitter
- Integrated Process Management (IPM)
- Real time process observation camera
- Advanced system software with adaptive process library
- Process transfer from system to system
- Process flexibility due to modular concept
|
|
- Hands-off die placement, user independent process operation
- Outstanding placement accuracy and instant operation without adjustments
- Synchronized control of all process related parameters: force, temperature, time, power, process environment, light and vision
- Immediate visual feedback reduces process development time
- Fast and easy process development, process recording and reporting, photo capture
- Process transfer from R&D to production saves time, guarantees reliable results
- One system handles a wide variety of applications
|
|
|
|
Technologies |
|
Applications |
|
|
|
|
|
|
Technical Specifications |
|
|
Placement accuracy*: |
|
5 µm |
Field of view (min)1: |
|
1.6 mm x 1.2 mm |
Field of view (max)1: |
|
20 mm x 15 mm |
Component size (min)1: |
|
0.125 mm x 0.125 mm |
Component size (max)1: |
|
40 mm x 40 mm |
Theta fine travel: |
|
± 6° |
Z-travel |
|
10 mm |
Working area1: |
|
280 mm x 117 mm |
Bonding force (max)1,2*: |
|
400 N |
Heating temperature (max)1,2*: |
|
400 °C |
|
|
|
Modules & Options |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|