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A unique six-in-one test system used to characterise
solder paste in compliance with both IPC and IEC Standards.
The SPA 1000 also introduces new process control capability
by accurately measuring the suitability of the solder
paste prior to its implementation on the production
line. It achieves this by determining the "Open-Time"
for the paste. It also performs the Slump Test and both
of these methods provide a "Go/No Go" answer
in less than 30 minutes to ensure minimum delay for
the production line.
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